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@@ -67,7 +67,7 @@ These additional publications cover many of the internal components used in Chip
       * **SonicBOOM (BOOMv3)**: J. Zhao, et al., *CARRV'20*. [PDF](https://carrv.github.io/2020/papers/CARRV2020_paper_15_Zhao.pdf).
       * **COBRA (BOOM Branch Prediction)**: J. Zhao, et al., *ISPASS'21*. [PDF](https://ieeexplore.ieee.org/document/9408173).
     * **Hwacha**: Y. Lee, et al., *ESSCIRC'14*. [PDF](http://hwacha.org/papers/riscv-esscirc2014.pdf).
-    * **Gemmini**: H. Genc, et al., *arXiv*. [PDF](https://arxiv.org/pdf/1911.09925).
+    * **Gemmini**: H. Genc, et al., *DAC'21*. [PDF](https://arxiv.org/pdf/1911.09925).
 * **Sims**
     * **FireSim**: S. Karandikar, et al., *ISCA'18*. [PDF](https://sagark.org/assets/pubs/firesim-isca2018.pdf).
         * **FireSim Micro Top Picks**: S. Karandikar, et al., *IEEE Micro, Top Picks 2018*. [PDF](https://sagark.org/assets/pubs/firesim-micro-top-picks2018.pdf).