Remove hwacha/esp-tools

This commit is contained in:
Jerry Zhao
2024-04-19 10:32:50 -07:00
parent 5870c6e4d4
commit 838cd9a69f
31 changed files with 16 additions and 9004 deletions

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@@ -16,7 +16,7 @@ To get started using Chipyard, see the stable documentation on the Chipyard docu
Chipyard is an open source framework for agile development of Chisel-based systems-on-chip.
It will allow you to leverage the Chisel HDL, Rocket Chip SoC generator, and other [Berkeley][berkeley] projects to produce a [RISC-V][riscv] SoC with everything from MMIO-mapped peripherals to custom accelerators.
Chipyard contains processor cores ([Rocket][rocket-chip], [BOOM][boom], [CVA6 (Ariane)][cva6]), accelerators ([Hwacha][hwacha], [Gemmini][gemmini], [NVDLA][nvdla]), memory systems, and additional peripherals and tooling to help create a full featured SoC.
Chipyard contains processor cores ([Rocket][rocket-chip], [BOOM][boom], [CVA6 (Ariane)][cva6]), accelerators ([Gemmini][gemmini], [NVDLA][nvdla]), memory systems, and additional peripherals and tooling to help create a full featured SoC.
Chipyard supports multiple concurrent flows of agile hardware development, including software RTL simulation, FPGA-accelerated simulation ([FireSim][firesim]), automated VLSI flows ([Hammer][hammer]), and software workload generation for bare-metal and Linux-based systems ([FireMarshal][firemarshal]).
Chipyard is actively developed in the [Berkeley Architecture Research Group][ucb-bar] in the [Electrical Engineering and Computer Sciences Department][eecs] at the [University of California, Berkeley][berkeley].
@@ -65,7 +65,6 @@ These additional publications cover many of the internal components used in Chip
* **BOOM**: C. Celio, et al., *Hot Chips 30*. [PDF](https://old.hotchips.org/hc30/1conf/1.03_Berkeley_BROOM_HC30.Berkeley.Celio.v02.pdf).
* **SonicBOOM (BOOMv3)**: J. Zhao, et al., *CARRV'20*. [PDF](https://carrv.github.io/2020/papers/CARRV2020_paper_15_Zhao.pdf).
* **COBRA (BOOM Branch Prediction)**: J. Zhao, et al., *ISPASS'21*. [PDF](https://ieeexplore.ieee.org/document/9408173).
* **Hwacha**: Y. Lee, et al., *ESSCIRC'14*. [PDF](http://hwacha.org/papers/riscv-esscirc2014.pdf).
* **Gemmini**: H. Genc, et al., *DAC'21*. [PDF](https://arxiv.org/pdf/1911.09925).
* **Sims**
* **FireSim**: S. Karandikar, et al., *ISCA'18*. [PDF](https://sagark.org/assets/pubs/firesim-isca2018.pdf).
@@ -87,7 +86,6 @@ These additional publications cover many of the internal components used in Chip
This work is supported by the NSF CCRI ENS Chipyard Award #2016662.
[hwacha]:https://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-262.pdf
[hammer]:https://github.com/ucb-bar/hammer
[firesim]:https://fires.im
[ucb-bar]: http://bar.eecs.berkeley.edu